Description 

Technical Paramerers

Remarks 

Product Scope

1-40 Layer  Rigid-PCB，

Max Panel size  

600*1200mm

Base Material 

CEM1 ,FR-4, Ceramic Plate

Material

Kingboards(KB-6150,KB6160), nanya ，shengyi (S1141,S1147), Rogers 4350 and Rogers 4003 ,taixing (F4B), Taconic (TLF-35,rf-35), Halogen-free,Hi frequency/Microwave

      Surface Finished 

Hals, Lead free HAL ,Immersion gold ,immersion Tin, Immersion sliver, OSP,  Gold Plating ，Carbon oil board

Peel-off / gold finger

Thickness finished:  

0.2~4.5 mm

Thickness of copper  

18um/25um/70um~245um(outer layer：0.5oz~7oz)18um/25um/70um~210um(inner layer：0.5oz~6oz)

Special copper customer made

Tolerance of finished board : 

± 0.15mm

V-CUT Position controller: 

± 0.1mm

Accuracy of hole position: 

±0.076mm

Min punching hole diameter

thickness ＜1.0mm   1.0mm

1.2-3.0mm  thickness 1.5mm

Min punching slots size:

Thickness ＜1.0mm    0.8X 0.8mm

Thickness 1.2-3.0mm   1.0 x 1.0mm

Min line width/space

0.10mm/0.10mm(4 mil./4mil.)

Min hole /PAD

0.1mm/PAD:0.4mm.

Controlled Impedance tolerance 

±10%（min±7 Ohm）

Impedance patterns

Differential impedance ,  Single-ended impedance

Shaping tolerance：

CNC routing ：±0.1mm  /  Punching：±0.15mm

Plating thickness: 

Gold Plating: Ni:2.5~5um,Au 0.05~0.1um 0.025~0.075um

Immersion gold :Ni 5~8um,Au 0.09~0.1um

HAL LF:3~30um 4~40um

Immersion Tin:0.6~1.2um

Immersion sliver:0.2~0.6um

OSP：0.1~0.4um

V-cut  Angular deviation

± 5°

V-cut  thickness  limits  

0.6~3.2mm

Min legend 

0.15mm

Bow & Twist

0.7% （standard）； 0.5%（with SMT ）

Acceptance Criteria

GB/T 16261-1996 ，IPC- 6012 Class Ⅱ

limits of our ability with  IPC- 6012 Class Ⅲ

PP

7628（0.185mm ）， 2116（0.105mm），

1080（0.075mm）， 3313（0.095mm ），

RO4403 （4mil ）， RO4350(4mil)

SPEED BRORD C;6700; 49N

Blind buried hole

Non cross blind buried, lamination with three times

Ultimate lamination with six  times

AOI

Max board size : 23.5×26 inch  ,thickness : 0.05--5.0 mm  

Min solder bridge

4mil （green）， 5mil （other color）

Color of solder mask

 Green , Yellow ,Blue ,Red ,white ,Black , Purple

 Others need confirm

Solder mask hardness

  6H

Peel-able

SD-2955  , PETERS 

Peel-able thickness

0.20--0.50mm  

Min Space peel-able to PAD

16 mil  

Ultimate with 14 mil

Gold finger Nickel thickness

   3-5um  

Gold finger Gold thickness

  0.8-1.3um  

Maximum gold- finger length

  2inch  

Minimum distance between gold fingers

  7mil  

Ultimate with 5 mil

ENIG FINISHED - Nickel thickness

3—8um  

ENIG FINISHED – Gold thickness

 0.05--0.75um

Ultimate with  0.05 —1.0UM

Immersion Tin thickness

 0.80-1.20um  

Immersion silver thickness

 0.10-0.30um

OSP thickness

 0.15-0.30um  

HAL LF thickness

2－40um  

Test voltage

200 v

Ultimate with 500 V

Test Current

 200 MA