Type

Item

Process capability

Surface Finished

 OSP, Immersion Ag, plating

silver, ENIG,HAL-LF

Laminate Type

 Aluminum,  iron

and Copper isolation base

General Dimension

500*600mm,457*610mm,600*1200m

m

Laminate

General Board

0.4mm,0.8mm,1.0mm,1.2mm,1.6mm,

thickness

2.0mm,2.5mm,3.0mm,4.0mm,5.0mm

Copper foil

0.5-10 OZ

Tolerance of board

±0.1mm

thickness

Dielectric thickness

0.075-0.15mm

AI type

1060、3003、5052、6061

Layer

1-2 layers

Min trace width

5mil

circuit

Min trace space

5mil

±15%

Tolerance of trace width/space

Copper foil

Internal and external

0.5-10 OZ

Drilling Hole Size

1.0-6.0MM

Finished Hole Size

1.0-6.0MM

Hole

Hole Tolerance

±0.075MM

Tolerance of Hole Position

±0.075MM

Aspect Ratio

5 : 1

Solder

 Min Solder Bridge

4MIL

Size

±0.1MM

Tolerance of Outline Dimension

Max Dimension

ength: 1500MM, Width: 600MM

Low Heat Conduction 1.0-1.2W/M.K

Middle Heat Conduction 1.5-1.8 W/M.K

Heat Conduction

High Heat Conduction 2.0 W/M.K 、3.0 W/M.K

Modulus

High Heat Conduction 5.0 W/M.K、8.0 W/M.K

Peel

>1.8 N/MM

Strength

Surface Resistance

Volume Resistivity

AC:2KV、4KV

Breakdown Voltage

Solder Fioat

288  .  10s,   No Sparkling ,   No Layering

Permittivity

≤4.4

≤0.03

(Disspation Factor)