Material Vendor ：FR4 High TG170 +Rogers 4000
Layer /pcb thickness :  6 Layer / 1.6 mm 
Copper thickness : 1oz copper 
Solder mask /silkscreen  ;Green solder mask/ white silkscreen
Surface finished :immersion gold
Min width/space: 4.5 / 3.5mil 
Min holes : 0.2mm
Thickness &Hole-diameter ratio :10.01
BGA size : 0.45mm 
Technical  Requirement:
1,Shengyi High -tg 170  & Rogers 4000 
2,Quality requirement with IPC class III standard
Standard Produce time : 8-12 days 

 Material characteristics: 

RO4000 material possesses the properties neededby designers of RF Microwave circuits. Stable electrical properties over environmental conditionsallow for repeatable design of filters, matching networks and controlled impedance transmissionlines. Low dielectric loss allows RO4000 series material to be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates. The temperaturecoefficient of dielectric constant is among the lowest of any circuit board material making it ideal for temperature sensitive applications. RO4000 materials exhibit a stable dielectricconstant over a broad frequency range (Chart 2). This makes it an ideal substrate for broadbandapplications.

RO4000 material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4000 material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multilayer board constructions. The Z-axis CTE provides reliable plated through-hole quality,even in severe thermal shock applications. RO4000 series material has a Tg of> 280 ° C (536 ° F)so its expansion characteristics remain stable over the entire range of circuit processingtemperatures.