1，Qualification and Performance Specification for Rigid Printed Boards

The Association Connecting Electronics Industries – commonly known as IPC (Institute of Printed Circuits) – is an international trade association serving the printed circuit board and electronics assembly industries. IPC is known globally for its standards that verify the quality of the manufactured PCBs and PCB assemblies.

The standard specifies the requirements of rigid PCB in detail, including appearance, intrinsic characteristics, reliability, as well as conventional testing and structural integrity testing requirements.

2，IPC-6012: Qualification and Performance Specification for Rigid Printed Boards

IPC-6012 is a specification which establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. The requirements apply to single-sided, multilayer boards, active / passive embedded circuit printed boards, HDI, and metal core printed boards.

Serial -Number -Name

1 IPC-A-600G PCB Qualification Conditions
2 IPC-6011 PCB  General Performance Specification
3 IPC-6012 Rigid PCB Qualification and Performance Specification
4 IPC-D-300G PCB Dimension and Tolerance
5 IPC-4101 Specification for rigid and multilayer PCB 
6 IPC-4103 Specification for Substrates for High Frequency/High Speed Applications
7 IPC-6018 Microwave PCB Inspection and Test Standards

3，Terminology and definition

Inspection
The same material, the same process, the same structure, before and after the manufacture of less than a month and once sent to inspection products, it was inspection .

Rejection of approval
The inspection batches that fail to pass the sampling inspection are called rejection batches. Vendors can re-check 100% of rejected PCBs and reject them. Except the re-inspection of defective circuit boards.

Appearance characteristics

Shape items that can be seen and detected. Some defects, such as voids and bubbles, are inherent in nature, but they can be detected from the outside and still belong to the appearance characteristics. 

Intrinsic characteristics
The inspection batches that fail to pass the sampling inspection are called rejection batches. Vendors can re-check 100% of rejected PCBs and reject them. Except the re-inspection of defective circuit boards.

Compliance section

the quality based with edge microsection, the quality of the base material can be judged. This kind of microsection is called compliance section

Edge spacing

The distance between the nearest conductors on the board.

4 ,Document Priority

When the terms of the document conflict, they are dealt with in the following order of priority:

● Engineering Confirmation
● Design Change Requirements (including PCB General Problem Handling Requirements) and design document compression package requirements)
● PCB Design Document (Production Master Drawing)
● Conventional Manufacturing Protocol for PCB Conventional Problem Solutions
● PCB Inspection Standard
● IPC related standards

Tolerance of Board Thickness

Remarks ：The measurement of  thickness is based on the maximum thickness of PCB. When there is a golden finger on PCB, the position of golden finger is measured by plate thickness. (The edge of the board is an area 8 mm inward from the edge of the board)

PAD Dimension Tolerance Requirements

Mechanical burial/blind hole Local region copper ≥ 18um ≥ 15um

Remarks ：PTH measurement of pore wall roughness is based on resin surface.

Outline tolerance

Remarks : Position size refers to the tolerance of V-CUT to the forming edge.

solder resist

type：Liquid Photo-imageable Solder Masks。

band：The supplier must use the welding resistance certified by our company.

Tolerance of holes

Remark：

1、Aperture￠≤0.8mm，tolerance ±0.10mm ，Aperture￠＞0.8mm，tolerance±0.20mm

2、Fiducials tolerance：±0.076mm。

Dielectric Thickness Tolerance

Medium Thickness Tolerance Requirements

Material

Base material ：FR－4，The performance of base  metal should meet the requirements of IPC standards. Suppliers must use the products that have been approved by our company. The material should be cured completely. The ordinary Tg sheet Tg < 3 C, the medium Tg and the high Tg sheet Tg < 5 C, and the TEFLON sheet is not measurable.

5 ,Material quality（Basic requirements for materials used in rigid PCB fabrication.）

6 ，Final surface treatment.

Hot Air Leveling

1) Properties of tin-lead coating:
A. The tin and lead layers in the pads and holes are uniform and smooth.
B. The tin-lead thickness of SMT solder pad is 1-25um, and the tin-lead thickness in the hole meets the requirements of aperture tolerance and solderability.
C. Measuring position of tin-lead thickness: SMT pad with size ranging from 2.0 mm *2.0 mm to 1.0 mm *1.0 mm.
2) Weldability: It meets the requirement of weldability test standard.
3) Ion pollution: meet the requirements of ion pollution standards.

Immersion gold /ENIG 

1) The ENIG potion used by the supplier must be approved and evaluated by me before it can be used.
2) ENIG coating properties:
A. The ENIG coatings on the pads and holes are uniform and smooth, with a golden appearance and no pollution, oxidation, darkening and other phenomena.
B. Ni/Au thickness of ENIG coating:
ENIG Coating Thickness Level 1 Standard Level 2 Standard
Ni 2.0-8.0um 3.0-8.0um
Au 0.05-0.150.05-0.15
C. Measuring position of Ni/Au thickness: SMT pad with size ranging from 2.0 mm *2.0 mm to 1.0 mm *1.0 mm.
D. ENIG coating peeling test: According to IPC-TM-6502.4.1 requirements, no gold peeling.
3) Weldability: meets the requirement of weldability test standard.
4) Ion pollution: meet the requirements of ion pollution standards.
5) ENIG process is not allowed to rework.

Organic Solderability Preservatives（OSP）

1) The OSP solution used by the supplier must be approved and evaluated by me before it can be used.
2) OSP film performance:
A. The OSP film in the pad and hole is uniform, glossy, non-polluting and darkening.
B. OSP film thickness: 0.3-0.6um.
3) Weldability: Weldability test after 1 Reflow (peek Temp 260+5 C/60-90s) aging still meets my requirement for weldability
Standard requirements for sex testing.
4) Ion pollution: meet the requirements of our ion pollution standards.

Immersion silver

1) The chemical silver solution used by the supplier must be certified and evaluated by me before it can be used.
2) Properties of electroless silver coating:
A. The ImmAg coating in the pad and hole is smooth and uniform, the silver surface is white, no pollution, yellowing, blackening and other phenomena.
B. ImmAg coating thickness: 0.1-0.3um.
C. ImmAg coating peeling test: According to IPC-TM-6502.4.1 requirements, no silver peeling.
3) Weldability requirements: meet the requirements of weldability testing standards.
4) Ion pollution: meet the requirements of ion pollution standards.
5) Javanni effect: the Javanni effect at the boundary between resistance welding and ImmAg coating, which results in copper corrosion depth less than line copper
The thickness is 20% and the copper thickness of the line is more than 25.4um.
6) Chemical silver process is not allowed to be reworked.
7) Packaging requirements: Sulphur-free paper between board and board, vacuum packaging.

Immersion Tin 

1) The supplier must be certified and evaluated by me before using chemical tin solution.
2) Properties of electroless tin coating:
A. The ImmSn coating in the pad and hole is smooth and uniform, the tin surface is gray-white, no pollution, yellowing, blackening and other phenomena.
B. ImmSn coating thickness: 0.1-0.3um.
C. ImmSn coating peeling test: According to IPC-TM-6502.4.1 requirements, no tin peeling.
3) Weldability: It meets the requirement of weldability test standard.
4) Ion pollution: meet the requirements of ion pollution standards.
5) Immersion l tin process is not allowed to be reworked.

Organic Solderability Preservatives（OSP）

1) The OSP solution used by the supplier must be approved and evaluated by me before it can be used.
2) OSP film performance:
A. The OSP film in the pad and hole is uniform, glossy, non-polluting and darkening.
B. OSP film thickness: 0.3-0.6um.
3) Weldability: Weldability test after 1 Reflow (peek Temp 260+5 C/60-90s) aging still meets my requirement for weldability
Standard requirements for sex testing.
4) Ion pollution: meet the requirements of our ion pollution standards.

Gold-plated finger

Nickel-gold thickness：Nickel thickness≥2.54um，gold thickness≥0.8um。

See the picture , A is the key area of golden finger. B and C are non-critical areas

Remark ；：A=3/5L、B=C=1/5L； B is more important than C in non-critical areas.

Notch/halo

Reference resources  IPC-A-600G-2 
Qualified：Unnotch/ halo；The edge notch has not penetrated more than 1 mm or 50% of the nearest wire spacing (the minimum value of both), and the formed sheet is still within tolerance range.

Unqualified: exceeding the above standards.

Angle/Edge Damage
 

Qualification: No damage or edge or corner damage has not yet been delaminated.
Unqualified: Layered edge and corner damage laminate

impedance
Qualification: Characteristic Impedance does not exceed <10% of the design value.
Unqualified: Characteristic Impedance has exceeded (+10%) of the design value.

7，PCB Test

Describe the routine test methods for PCB before shipment. 
Cleanliness test:

Experimental equipment: Ion residue tester.
Method: 75% isopropanol and 25% deionized water (pure water) were used.
The solution was washed and its resistance was measured, which was then converted into equivalent NaCl content.
Qualification index: The measured equivalent NaCl value is less than 1.0ugNaCl/cm2. PCB and incoming PCB before solder resistance coating should meet the requirement of cleanliness.

Weldability test

According to the latest edition of IPC J-STD-003, the weldability test is carried out. The acceptance criteria are as follows:
(1) Evaluation criteria for surface pads
A. The wettability area of the pad surface is more than 95%. Small pin holes/dewetting areas/rough spots are allowed, but all these defects cannot be concentrated in one area.
B. Non-wetting and bareness of base metal are not allowed in the evaluation area.
C. Weldability is not evaluated in the area within 3.2 mm from the edge of the test sample and in the installation area.
(2) Evaluation criteria for through-hole plating:
The solder should wet the through-hole wall and plug the through-hole (< 1.5mm) (incomplete filling is allowed, but depth is at least 50%.
There is no wettability and bareness of the base metal on the plated through-hole wall.

Open and Short of Electrical Test 

Test conditions: test voltage (> 200V), short circuit resistance (20M), open circuit resistance (20).
Qualification: PCB passes the above condition test.

Improvement plan

When the reliability test and evaluation of the samples are not qualified, the supplier should draw up a specific improvement plan. If the non-conformity is caused by the process and raw materials, the original process and materials should not be used for PCB production until the improvement plan is completed. Additional tests are needed to ensure the reliability of the PCB produced during this period.

After the improvement plan is completed, reliability test is also required before the product ship out ,to verify the effectiveness of the improvement plan. 

AQL meets the following requirements： MA=0.65，MI=2.5。
All raw material suppliers should have a sound quality assurance system. The characteristics of raw materials shall meet the quality requirements of relevant specifications. Suppliers shall conduct periodic sampling inspection of all raw materials in accordance with their own quality assurance system requirements.
When the whole board or even the whole batch of qualified defects occur, it can be considered that the supplier's process control has begun to run out of control, and the buyer will retain the right to return the goods.

FA REPORT 

Each delivery report of our company should have two copies. The delivery report should include Electrical Performance Measurement Report, Final Product Inspection Report, Microsection Report, Weldability Test Report.

8,Quality Assurance

9,Packing  Requirement  

Inner Packing

Transparent balloon plastic bag vacuum packaging, humidity card inside, and ensure tight packaging.
All boards should be directed in one direction, so that no disorder of direction can occur.

Out Packing

The outer packing material is corrugated box. The voids around the box must be filled with Pearl sponge.   

Label Requirements

There will be multiple vacuum packages in a carton of PCBs, each vacuum package must be labeled according to the following rules:      
 

A.Internal labels are required to be affixed to the upper left corner of the front side of the vacuum packaging. The labels can be seen after opening the box.
B. Packaging should be marked as follows: customer model, quantity, unit, date, etc. Details should be filled in according to the label.
C. Outer box labels are uniformly attached to the smallest side of the box section, and one label is attached to each box. Don't put it on the top of the box.
D. All outer case labels must be uniformly attached to the upper right corner of the outer case. (Pay attention not to cover labels with sealing tape) No alteration or handwriting is allowed for all markings. In order to prevent labels from blurring due to collisions during transportation, all outer case labels should be covered with transparent tape.

Packing requirements

A. Ensure each packing case has only one type of board.
B. Integer boxes can only be put in one DC per box.
C. Processing tail boards can be put in three DCs per box. Note: Include the quantity of each DC product.
D. No more than 8 DCs per PO order.
E. According to the calculation of panel DC, products exceeding 5 DC must be submitted to our TQC confirmation, accompanied by a baking record and a heat shock report. Only after our confirmation can ship the products.
F. For each batch of products, the number of boxes must be indicated in the outer box, which is the number of boxes.