A PCB manufacturing technology for removing the inner layer of non functional PAD from PTH through hole.

    In the training of engineer making CAM production  file, the PTH hole processing  treatment will be mentioned, one of which is to remove the PCB board of the inner non functional pad from the PTH through hole layer , delete the inner non functional pad, and use the avoidance space of the original pad for circuit design. In the conventional design, each through hole will have a copper pad larger than the drill hole in all layers, and the distance avoidance between different networks also includes the avoidance of these copper pads in the design; however, through deleting the non functional copper pads in the inner layer, the avoidance space of these original copper pads can be used for circuit design, greatly saving the design space. For extremely high productions, there are usually thousands of vias, so the space saved is significant.

     Nowadays, electronic products are developing towards the direction of high-speed, high-density and high-level design complexity, with more and more fine products and more functions. In design, people usually design by reducing the line width and line spacing, drilling size, or even using laser drilling, so as to increase the design space and realize more functions of products in a smaller design space. However, there are still some disadvantages in the existing technology: 1,too small line width and line distance will not only increase the difficulty of making circuit board, increase the cost, but also affect the signal flow; 2, too small drilling will lead to insufficient current flow, and insufficient flow, increase the number of drilling holes, which is not conducive to space saving.