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HOME    news    How much do you know about rogers materials
Created on:2019-08-02 03:10

How much do you know about rogers materials

 

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1. RT/duroid® 5000 (PTFE/random microfiber glass)
      There are two projects type  :RT/duroid 5870 ( r =2.33) and 5880 ( r =2.2),was the earliest product Rogers in the 1960s,and the dielectric constant is isotropic,and it can be used together with the PTFE / woven glass materials 。Its dielectric constant is the lowest and low loss of all products, which is very suitable for very high frequency / broadband applications to minimize propagation loss . Due to its low water absorptionn, RT / Duroid 5870 and 5880 are ideal for high humidity applications.

2. Ultralam® 2000 (PTFE/woven glass)
   Ultralam® 2000 is Rogers' PTFE / woven glass material to provide a high-performance, high-capacity commercial market. Ultralam 2000 uses only 1080 glass fibers for highly reliable applications.
 
3. RT/duroid® 6000 (PTFE/ceramic)
      there are three projects type ,RT/duroid 6006 ( r =6.15)  and 6010 ( r =10.2) material developed in the 1970s,Provides options for designers to reduce board size, Higher dielectric constant materials make the waveguide wavelength of the signal smaller, and the circuit can be made smaller.

      RT/duroid 6002 ( r =2.94) development was introduced in the 1980s,Material is characterized is temperature stability with superior dielectric constant,Thermal expansion coefficient of dielectric constant is very consistent with copper foil,to improve the shortage of PTFE substrate. This product is ideal for applications where the ambient temperature changes rapidly (aerospace). Due to its low dielectric loss and high reliability of metalized vias, it can be used for higher frequencies and multilayer circuit.

4. TMM® (Thermoset ceramic loaded plastic)
      TMM base material, TMM 3 ( r =3.27), TMM 4 ( r =4.5), TMM 6 ( r =6.0), TMM 10 ( r =9.2) and TMM 10i ( r =9.8),It is the perfect combination of ceramic and PTFE substrate. Entered the market in the 1990s,TMM Material is rigid for easy component installation,Can be easily fabricated with printed circuit board technology without the need for expensive processing of pure alumina thin film processes,same as RT6002 material, TMM has very good temperature characteristics and its electrical and mechanical properties are very stable. Due to its wide range of dielectric constants, the substrate can be used in aerospace applications, especially as microstrip flat panel antennas. 


5. RO3000® and RO3200® (PTFE/Ceramic)
     As early as the 1990s, there were three types of RO3000 commercial series first introduced, RO3003 ( r =3.0), RO3006 ( r =6.15) and RO3010 ( r =10.2). These materials combine the electrical characteristics of the microwave band with improved temperature stability and their cost is only a fraction of its parent (RT / duroid6000),The consistency of the thermal expansion coefficients on the x-y plane with FR4 and copper foil makes the RO3000 / FR4 hybrid multilayer boards have good reliability. Because of the low dielectric loss of RO3003, it can be used in relatively high frequency bands.
RO3200 series materials are composed of RO3203 (r = 3.02) and RO3210 (r = 10.2). They are suitable for applications where RO3000 series materials are used but require better mechanical strength. RO3200 series materials are laminated by combining PTFE / ceramic and PTFE / glass fiber woven cloth, and have good rigidity. Same as RO3000 materials, this series of materials can also be used to make mixed multilayer boards MLB with FR4.
 
 6. Antenna materials RO4730 LOPRO 3.0DK
      Antenna design engineers have traditionally had to make difficult choices between electrical performance and low price when selecting materials. Based on the RO4000 series, ROGERS now introduces RO4730 ™ LoPro ™, a low-price, low PIM value, Dk 3.0 antenna special material, which can meet the technical requirements of 4G antennas, and also meet the dual requirements of engineers for price and performance.    
 RO4730 antenna materials the unique organic hollow silicon ball is used as the filling material, which is 30% lighter than the PTFE material. In addition, the 4730 can be processed like the FR4 process, which greatly reduces equipment costs.

 

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