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Material Vendor :FR4 High 180 TG  /ROSH
Layer /pcb thickness :  8 Layer /3.2 mm 
Copper thickness : 2oz copper 
Solder mask /silkscreen  ;Non -solder mask/ white silkscreen
Surface finished :immersion gold
Min width/space: 5/ 8mil 
Min holes : 0.25mm
Technical  Requirement:

1,Press Fit holes -Via in PAD boards
2, differential impedance & single line impedance 
3, ITEQ High -tg 180    
4,Quality requirement with IPC class III standard
Standard Produce time : 7-10 days 

 

TOP PCB- Press Fit holes -Via in PAD boards